Fundamentals of Wafer Fabrication

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Fundamentals of Wafer Fabrication

Overview

Course Date:
TBA
Registration Period:
TBA
Duration/Frequency:
16 Hours
Mode of Training:
Face-to-Face (Classroom Teaching)
Venue:
Singapore Polytechnic
Funding:
Eligible for SkillsFuture Credit

This course provides Semiconductor Manufacturing personnel with the essential skills and practices for working in the Wafer Fabrication cleanroom.

Course Objective

Participants would be equipped with the skills and knowledge for working in the Wafer Fabrication cleanroom, handling Wafer tools and equipment, as well as identification of work hazards.

Course Outline

By the end of the Course, participants will be able to:

Name the essential facilities support for Wafer Fabrication in cleanrooms
Explain the best practices and protocol for cleanroom operations
Identify potential work hazards in a cleanroom environment, ensuring good safety practices
Demonstrate the procedures for operating in cleanrooms and handling hazardous chemicals
Make use of Wafer Fabrication handling tools such as vacuum wands, flat aligner tools, etc
Operate and perform basic Wafer Fabrication equipment setup

Topics to be covered

Introduction to Wafer Fabrication Facilities
Operating in Cleanrooms
Wafer Handling tools such as Vacuum Wands, Flat Aligner Tools, Transfer Jigs, etc.
Hands-On Session on Basic Operation and Setup of Wafer Fabrication Equipment; Wafer Handling, Photolithography and Etching

Minimum Requirements

Basic English Proficiency

Certification / Accreditation

• Certificate of Attendance (electronic Certificate will be issued)
A Certificate of Attendance will be awarded to participants who meet at least 75% attendance rate

• Certificate of Completion (electronic Certificate will be issued)
A Certificate of Completion will be awarded to participants who pass the assessment and meet at least 75% attendance rate